Publications by Lee, M

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Journal Articles (3)
Lee, M, Yeo, E, Blacklock, M, Janardhana, M, Feih, S and Wang, C 2015, 'Predicting the strength of adhesively bonded joints of variable thickness using a cohesive element approach', International Journal of Adhesion and Adhesives, vol. 58, pp. 44-52. 28   11 0
Lee, M, Yeo, E, Blacklock, M, Janardhana, M, Feih, S and Wang, C 2015, 'Predicting the strength of adhesively bonded joints of variable thickness using a cohesive element approach', International Journal of Adhesion and Adhesives, vol. 58, pp. 44-52. 50   11 Cited 5 times in Scopus5 0
Lee, M, Wang, C and Yeo, E 2013, 'Effects of adherend thickness and taper on adhesive bond strength measured by portable pull-off tests', International Journal of Adhesion and Adhesives, vol. 44, pp. 259-268. 177   0
Conference Papers (2)
Lee, M, Blacklock, M, Janardhana, M and Wang, C 2014, 'Predicting pull-off strengths of bonded joints using cohesive elements', in R. Das and S. John (ed.) Proceedings of the 8th Australasian Congress on Applied Mechanics, Melbourne, Australia, 24-28 November 2014, pp. 1-8. 134  
Lee, M, Yeo, E, Janardhana, M and Wang, C 2012, 'Effect of off-normal loading on the bond strength measurement of bonded repairs', in Prof I. Grant, Detlef Muller-Wiesner, Murray Scott (ed.) Proceedings of the 28th International Congress of the Aeronautical Sciences, Brisbane, Australia, 23-28 September, 2012, pp. 1-11. 209  
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