Deformation modeling of a communication device during the processing of a multifunctional polymetric material

Sulic, E, Pell, B, John, S, Battacharya, S, Gupta, R, Rowe, W, Ghorbani, K, Zhang, K and Hughes, B 2009, 'Deformation modeling of a communication device during the processing of a multifunctional polymetric material', in J.F. Silva Gomes; Shaker A. Meguid (ed.) Proceedings of the 3rd International Conference on Integrity, Reliability and Failure, Porto, Portugal, 20-24 July 2009, pp. 1-17.


Document type: Conference Paper
Collection: Conference Papers

Title Deformation modeling of a communication device during the processing of a multifunctional polymetric material
Author(s) Sulic, E
Pell, B
John, S
Battacharya, S
Gupta, R
Rowe, W
Ghorbani, K
Zhang, K
Hughes, B
Year 2009
Conference name 3rd International Conference on Integrity, Reliability and Failure
Conference location Porto, Portugal
Conference dates 20-24 July 2009
Proceedings title Proceedings of the 3rd International Conference on Integrity, Reliability and Failure
Editor(s) J.F. Silva Gomes; Shaker A. Meguid
Publisher INEGI - Instituto de Engenharia Mecanica e Gestao Industrial
Place of publication Porto Portugal
Start page 1
End page 17
Total pages 17
Abstract In this paper, an attempt is made to model the deformation of a communication device to be embedded in a viscoelastic thermoset composite polymer commonly known as Sheet Moulding Compound (SMC). This model will take into account time dependent heat transfer from the mould surface into the SMC charge and the consequent time dependent viscosity propagation during the initial stage of mould closing and subsequent filling. The required model parameters for viscosity and elasticity have been determined from rheological testing. A number of process parameters such as mould closing speed, mould temperature and communication device position in the mould are investigated using both Maxwell's springdashpot and Arrhenius' equations. The effect of these parameters on the deformation of the communication device is discussed and compared to experimental findings.
Subjects Electrical and Electronic Engineering not elsewhere classified
ISBN 9789728826215
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