Planarisation of patterned aluminium/diamond surfaces for SAW devices

Holland, A, Reeves, G and Leech, P 2003, 'Planarisation of patterned aluminium/diamond surfaces for SAW devices', in M. Olliver et.al. (ed.) Materials Research Society Symposium Proceedings Vol 767, San Francisco, USA, 22-24 April 2004.


Document type: Conference Paper
Collection: Conference Papers

Title Planarisation of patterned aluminium/diamond surfaces for SAW devices
Author(s) Holland, A
Reeves, G
Leech, P
Year 2003
Conference name Materials Research Society Symposium Proceedings
Conference location San Francisco, USA
Conference dates 22-24 April 2004
Proceedings title Materials Research Society Symposium Proceedings Vol 767
Editor(s) M. Olliver et.al.
Publisher The Materials Research Society
Place of publication Warrendale, USA
Abstract A novel method for forming interdigitated electrodes for GHz Surface acoustic wave (SAW) devices on diamond using a damascene-like polishing technique is described. Low aspect ratio Al electrodes are recessed into the diamond substrates to create a near planar surface. This allows the deposition of higher quality oriented ZnO. CVD diamond samples were ion-beam etched with groove widths in the range 1-5mm to a depth of 80-120nm. Al (120nm thick) was sputter deposited on to the etched diamond and was polished using either (i) a solution of 0.05µm silica on a neoprene polishing cloth or (ii) using a ~0.12mm thick PVDF (polyvinylidene difluoride) filter pad with colloidal solutions of silica. Using AFM scans and optical microscopy it was observed that the combination of method (i) with the small sample size resulted in significant hollowing-out of the Al electrodes and complete removal of Al from over 90% of the pad-interconnect area. The alternative technique in (ii) demonstrated far less Al removal and better uniformity in the electrode patterns.
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