Ka-Band LTCC Stacked Substrate Integrated Waveguide Bandpass Filter

Zheng, P, Liu, Z, Ma, M, Wang, Y, Liu, F and Li, Y 2018, 'Ka-Band LTCC Stacked Substrate Integrated Waveguide Bandpass Filter', Wireless Communications and Mobile Computing, vol. 2018, pp. 1-7.


Document type: Journal Article
Collection: Journal Articles

Title Ka-Band LTCC Stacked Substrate Integrated Waveguide Bandpass Filter
Author(s) Zheng, P
Liu, Z
Ma, M
Wang, Y
Liu, F
Li, Y
Year 2018
Journal name Wireless Communications and Mobile Computing
Volume number 2018
Start page 1
End page 7
Total pages 7
Publisher John Wiley & Sons Ltd.
Abstract A Ka-band substrate integrated waveguide bandpass filter has been designed and fabricated using low temperature co-fired ceramic (LTCC) technology. The in-house developed SICCAS-K5F3 material with a permittivity of 6.2 and a loss tangent of 0.002 was used. The size and surface area of the proposed bandpass filter are reduced by exploiting vertical coupling in vertically laminated three-dimensional structures. The coupling between adjacent cavities is realized by a narrow slot. A vertical transition structure between the coplanar-waveguide feed line and the substrate integrated waveguide is adopted to facilitate the internal signal connection. The demonstrated third-order filter has a compact size of 6.79 mm×4.13 mm×1.34 mm (0.630 × 0.380 × 0.120) and exhibits good performance with a low insertion loss of 1.74 dB at 27.73 GHz and a 3 dB fractional bandwidth of 10 %.
Subject Communications Technologies not elsewhere classified
DOI - identifier 10.1155/2018/9737219
Copyright notice Copyright © 2018 Peng Zheng et al. Creative Commons Attribution License
ISSN 1530-8677
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