Thermal characterization of a copper microchannel heat sink for power electronics cooling

Singh, R, Akbarzadeh, A, Mochizuki, M, Nguyen, T and Nguyen, T 2009, 'Thermal characterization of a copper microchannel heat sink for power electronics cooling', Journal of Thermophysics and Heat Transfer, vol. 23, no. 2, pp. 371-380.


Document type: Journal Article
Collection: Journal Articles

Title Thermal characterization of a copper microchannel heat sink for power electronics cooling
Author(s) Singh, R
Akbarzadeh, A
Mochizuki, M
Nguyen, T
Nguyen, T
Year 2009
Journal name Journal of Thermophysics and Heat Transfer
Volume number 23
Issue number 2
Start page 371
End page 380
Total pages 10
Publisher American Institute of Aeronautics and Astronautics, Inc
Abstract An investigative prototype of a single-phase cooling system based on the microchannel heat sink with water as the heat transfer medium was developed to study the fluid flow and forced-convection heat transfer characteristics for the cooling of electronics microprocessors with extremely high heat fluxes. The microchannel heat sink was made from copper with a high fin aspect ratio of 17.5. In the experiment, pressure losses through the heat sink and thermal characteristics of the cooling section under different heat fluxes (25 to 200W from 7 x 7 mm2 and 11 x 13 mm2 heat sources) and coolant flow rates (1.7 to 15 cm3=s) were studied. Under similar test conditions, minimum cold-plate thermal resistances Rcp of 0.11 and 0:33ºC=W were achieved with 11 x 13 mm2 and 7 x 7 mm2 sources, respectively. Heat fluxes of up to 4:1 MW=m2 were effectively dissipated while maintaining a junction temperature below 100ºC. With a 15 cm3=s (Re =150) coolant flow rate, maximum values of 5334 W=m2 · Kfor the convection heat transfer coefficient and 3.4 for the Nusselt number were achieved with a 3.3 kPa coolant pressure drop through the system. As an outcome of the present investigation, the copper water-based microchannel heat sink has proved to be a reliable cooling solution for high-end microprocessors.
Subject Mechanical Engineering not elsewhere classified
DOI - identifier 10.2514/1.40033
Copyright notice © 2008 by the American Institute of Aeronautics and Astronautics, Inc.
ISSN 0887-8722
Versions
Version Filter Type
Citation counts: TR Web of Science Citation Count  Cited 2 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 3 times in Scopus Article | Citations
Altmetric details:
Access Statistics: 262 Abstract Views  -  Detailed Statistics
Created: Wed, 22 Dec 2010, 10:15:00 EST by Catalyst Administrator
© 2014 RMIT Research Repository • Powered by Fez SoftwareContact us