Distributed circuit modeling of multilayer capacitor parameters related to the metal film layer

Brown, R 2007, 'Distributed circuit modeling of multilayer capacitor parameters related to the metal film layer', IEEE Transactions on Components and Packaging Technologies, vol. 30, pp. 764-773.


Document type: Journal Article
Collection: Journal Articles

Title Distributed circuit modeling of multilayer capacitor parameters related to the metal film layer
Author(s) Brown, R
Year 2007
Journal name IEEE Transactions on Components and Packaging Technologies
Volume number 30
Start page 764
End page 773
Total pages 10
Publisher IEEE
Abstract Linkage between the distributed-circuit capacitor model and multi-layer capacitor structures is demonstrated. Capacitor inductance leading to self-resonance in standard metallized polymer capacitors arises from lead and package inductance and can be represented by lumped inductance external to the capacitor modeling in this paper. Distributed internal capacitor inductance is negligible in metallized polymer capacitors for most applications and therefore is not considered in the analysis. Two different distributed-circuit topologies, both of which arise in practice-one by design and the other by degradation-are considered. One has the two connecting electrodes on opposite ends of the capacitor and the other has both input electrodes on the same end. The electrical performance of the two connection topologies is compared using numerical 10-stage lumped element modeling. Cross comparisons are made using diffusion equation modeling for the single-end connection topology. Strong correspondence between results from numerical lumped element distributed approximations and from diffusion equation analysis for the single-end connection is demonstrated up to 100MHz, this inferring similar accuracy for lumped element modeling of the double-end connected capacitor topology.
DOI - identifier 10.1109/TCAPT.2007.909152
Copyright notice © 2007 IEEE
ISSN 1521-3331
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