A note on the thermal modelling of power semiconductor devices using the network analogue

Wong, C 2002, 'A note on the thermal modelling of power semiconductor devices using the network analogue', International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, vol. 15, no. 3, pp. 283-286.


Document type: Journal Article
Collection: Journal Articles

Title A note on the thermal modelling of power semiconductor devices using the network analogue
Author(s) Wong, C
Year 2002
Journal name International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
Volume number 15
Issue number 3
Start page 283
End page 286
Total pages 3
Publisher John Wiley and Sons
Abstract The aim of this note is to point out that the boundary condition for the network modelling of thermal problems may have been incorrectly used in some previous studies. It is shown that the accuracy of the network analogue or the equivalent finite-difference method is on the par with the finite-element method for very fast transient thermal simulations.
Subject Colloid and Surface Chemistry
DOI - identifier 10.1002/jnm.443
Copyright notice © 2002 John Wiley & Sons
ISSN 0894-3370
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