Cathodic corrosion of Cu substrates as a route to nanostructured Cu/M (M=Ag, Au, Pd) surfaces

Najdovski, I, Periasamy, S and O'Mullane, A 2015, 'Cathodic corrosion of Cu substrates as a route to nanostructured Cu/M (M=Ag, Au, Pd) surfaces', ChemElectroChem, vol. 2, no. 1, pp. 106-111.


Document type: Journal Article
Collection: Journal Articles

Title Cathodic corrosion of Cu substrates as a route to nanostructured Cu/M (M=Ag, Au, Pd) surfaces
Author(s) Najdovski, I
Periasamy, S
O'Mullane, A
Year 2015
Journal name ChemElectroChem
Volume number 2
Issue number 1
Start page 106
End page 111
Total pages 6
Publisher Wiley
Abstract The electrochemical formation of nanostructured materials is generally achieved by reduction of a metal salt onto a substrate that does not influence the composition of the deposit. In this work, we report that Ag, Au and Pd electrodeposited onto Cu under conditions where galvanic replacement is not viable and hydrogen gas is evolved results in the formation of nanostructured surfaces that unexpectedly incorporate a high concentration of Cu in the final material. Under cathodic polarisation conditions, the electrodissolution/corrosion of Cu occurs, which provides a source of ionic copper that is reduced at the surface-electrolyte interface. The nanostructured Cu/M (M=Ag, Au and Pd) surfaces are investigated for their catalytic activity for the reduction of 4-nitrophenol by NaBH4, where Cu/Ag was found to be extremely active. This work indicates that a substrate electrode can be utilised in an interesting manner to make bimetallic nanostructures with enhanced catalytic activity.
Subject Electroanalytical Chemistry
Catalysis and Mechanisms of Reactions
Colloid and Surface Chemistry
Electrochemistry
Keyword(s) bimetallic
corrosion
heterogeneous catalysis
electrodeposition
nanostructures
DOI - identifier 10.1002/celc.201402259
Copyright notice © 2015 Wiley-VCH Verlag GmbH and Co. KGaA, Weinheim
ISSN 2196-0216
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